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Parker Chomerics CHO BOND® 1016 is a one-component, nickel-plated graphite filled conductive sealant formulated to provide galvanic corrosion resistance when mated with aluminum substrates

Parker Chomerics CHO BOND® 1019 is a two-component, silver-plated aluminum filled sealant formulated for EMI shielding of gaps and seams of military shelters and electrical enclosures

Parker Chomerics CHO-BOND® 1029 conductive adhesive is a two-component, silver-plated copper filled silicone formulated for flexible, strong, and electrically conductive bonds

Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates

Parker Chomerics CHO BOND® 1035 is a one-component, silver-plated glass filled sealant formulated to provide lightweight EMI shielding in commercial and military applications

Parker Chomerics CHO BOND® 1038 is a one component, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding

Parker Chomerics CHO BOND® 1075 is a one component, silver-plated aluminum filled sealant formulated to resist galvanic corrosion on aluminum substrates while providing excellent shielding and conductivity

Parker Chomerics CHO-BOND® 1077 is a nickel plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.

Parker Chomerics CHO-BOND® 1085 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND 1029 adhesive to metal and other non-silicone substrates.

Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding

Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications

Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds

Parker Chomerics CHO BOND® 4660 is a one-component, silver-plated copper filled conductive sealant specifically formulated for flexibility in applications where vibration resistance is required

Parker Chomerics CHO BOND® 4669 is a one-component, silver-plated copper filled conductive sealant specifically formulated for extended working life and flexibility in applications where vibration resistance is required

Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating

Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required

Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics

Parker Chomerics CHO-CELL™ Shielded Vent Panels are very high performance EMI shielding components meant to meet TEMPEST specifications for signal leakage from information systems and electronic enclosures

Parker Chomerics CHO-FOIL® metal foil tapes provide an economical solution to applications requiring excellent electrical conductivity across substrates

Parker Chomerics CHO-LUBE® 4220 Electrically Conductive Grease consists of a silver-filled silicone polymer and is meant for areas where continuous electrical paths are required

Parker Chomerics CHO-MASK® II is an EMI foil tape layered with a polyester paint masking meant to provide a conductive non-corroding surface on painted metal electronic enclosures.

Parker Chomerics CHO-MUTE™ 9005 Microwave Absorber material is comprised of a silicone elastomer matrix with ferrous filler material meant to provide excellent RF absorption at high frequencies

Parker Chomerics CHO-MUTE™ 9025 Microwave Absorber material is comprised of a silicone elastomer matrix with ferrous filler material meant to provide excellent RF absorption at lower frequencies

Parker Chomerics CHO-SHIELD® 1091 primer is an air-drying liquid coating for enhancing the adhesion of CHO-SHIELD® 2000 series electrically conductive coatings and CHO-BOND® 2165 to chemically treated aluminum, and most composite surfaces.

Parker Chomerics CHO-SHIELD® 2001 is a light pigmented, corrosion resistant, electrically conductive coating for aluminum or composite substrates.

Parker Chomerics CHO-SHIELD® 2002 is a chromate-free, corrosion resistant, electrically conductive coating for composite substrates.

Parker Chomerics CHO-SHIELD® 2003 is a dark pigmented, corrosion resistant, electrically conductive coating for aluminum or composite substrates.

Parker Chomerics CHO-SHIELD® 2040 EMI coating is a one-component, silver-filled conductive acrylic coating that is specially formulated to provide premium EMI shielding on plastic substrates

Parker Chomerics CHO-SHIELD® 2044 EMI coating is a one-component, nickel-filled acrylic coating that provides modest EMI shielding and a highly durable coating on plastic housings

Parker Chomerics CHO-SHIELD® 2056 EMI coating is a one-component, silver and silver-plated copper filled acrylic paint designed for high levels of EMI shielding on plastic substrates

Parker Chomerics CHO-SHIELD® 4994 conductive coating is a very smooth, highly conductive, silver-filled polyurethane designed for military/aerospace airframe applications

Parker Chomerics CHO-SHIELD® 568 conductive coating is a two-component, nickel-filled epoxy specially formulated to accept an electrolytic plating layer