Parker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages. Combined with innovative technologies and packaging designs, CHO-SHIELD® 571 can provide board level or package level EMI shielding of electrical components.
Applied correctly, CHO-SHIELD® 571 can replace stamped metal cans, saving valuable board space and reducing the overall cost of board level EMI shielding. The polymer system has been custom formulated to closely match the coefficient of thermal expansion (CTE) of typical epoxy molding compounds resulting in great adhesion and environmental stability of the coating on semiconductor devices.
Features/Benefits:
• Two component
• Silver in color
• Designed for high volume spray application
• Minimum 12 hour working life at room temperature
• Silver flake filler
• Excellent conductivity and EMI shielding of components
• Epoxy coating
• Good adhesion to semiconductor packaging materials due to CTE (coefficient of thermal expansion) match of polymer
• Environmentally stable
• Withstands wave solder temperatures in excess of 262°C (500°F)
Typical Applications:
• Board level EMI shielding of printed circuit boards (PCBs) or other electrical components
POLYMER FAMILY Epoxy
FILLER MATERIAL Silver
PACKAGING 2 component kit
A: 1 pint aluminum can
B: 4 fluid ounce amber bottle
PRIMER INCLUDED Not required
RATIO 100:8.3 by weight
COLOR Silver
VISCOSITY GRADE 19 to 25 seconds Zahn Cup 2
SURFACE RESISTANCE (OHMS/SQUARE) <= 0.010 SHIELDING EFFECTIVENESS (DB) >100
FILM THICKNESS (MM) 0.025
SPECIFIC GRAVITY 1.39
TEMPERATURE RANGE (C) -40 to 125
SHELF LIFE (MONTHS) 9
