Gösterilen sonuç sayısı: 7

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Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conductivity.

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Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity

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Parker Chomerics THERM-A-FORM CIP35 Thermally Conductive Cure-In-Place Compound

Parker Chomerics THERM-A-FORM™ CIP35 is two component dispensable thermal compound with 3.5 W/m-K thermal conductivity.

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Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.

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Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T646 is a two-component, high pot life (5 hours), economical silicone elastomer with 0.9 W/m-k thermal conductivity

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Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W/m-k) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.

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Parker Chomerics THERM-A-FORM™ T644 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T644 is a two-component, high thermal conductivity (1.2 W/m-k), low modulus, silicone material ideal for transferring heat from fragile electronic components.