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CHO-THERM T500 HIGH POWER THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PAD FOR EXTREME THERMAL APPLICATIONS

Parker Chomerics CHO-THERM® T500 high power electrical insulator pads have 2.1 W/m-k thermal conductivity and are ideal for applications requiring excellent dielectric properties.

PART NUMBER: 60-11-D427-T500

INTERFACE TYPE: Standard die-cut part without PSA

TYPE/CONFIGURATION: D427

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CHO-THERM T609 COMMERCIAL GRADE THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS

Parker Chomerics CHO-THERM® T609 commercial grade electrical insulator pad is the best value for moderate to high performance pads with a thermal conductivity of 1.5 W/m-k.

PART NUMBER: 60-11-D408-T609

INTERFACE TYPE: Standard die-cut part without PSA

TYPE/CONFIGURATION: D408

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Parker Chomerics CHO-BOND 1087 Silicone Adhesive Primer

Parker Chomerics CHO-BOND® 1087 primer is a low viscosity, blue liquid formulated to provide adhesion between our CHO-THERM® 1642 two component silicone based compound and non-silicone substrates such as metals, glass, plastic and ceramics.

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Parker Chomerics CHO-THERM THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS

Parker Chomerics CHO-THERM Thermally Conductive Electrical Insulator Pads are designed for use where the highest possible thermal, dielectric, and mechanical properties are required.

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Parker Chomerics T-WING Thin Heat Spreaders

Parker Chomerics T-Wing Thin Heat Spreaders provide a low cost, effective means of cooling high-density integrated circuit devices by conducting heat away from key components.

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Parker Chomerics T650 High-Performance 0.8 W/m-K Thermal Grease for General Purpose Use

Parker Chomerics T650 Thermal Grease is a general purpose grease ideal for applications on heat sinks with a thermal conductivity of 0.8 W/m-k.

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Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conductivity.

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Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity

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Parker Chomerics THERM-A-FORM CIP35 Thermally Conductive Cure-In-Place Compound

Parker Chomerics THERM-A-FORM™ CIP35 is two component dispensable thermal compound with 3.5 W/m-K thermal conductivity.

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Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.

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Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T646 is a two-component, high pot life (5 hours), economical silicone elastomer with 0.9 W/m-k thermal conductivity

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Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W/m-k) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.

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Parker Chomerics THERM-A-FORM™ T644 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM™ T644 is a two-component, high thermal conductivity (1.2 W/m-k), low modulus, silicone material ideal for transferring heat from fragile electronic components.

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Parker Chomerics THERM-A-GAP 570 Thermally Conductive Gap Filler Pads

Parker Chomerics THERM-A-GAP™ 570 Thermally Conductive Gap Filler Pads provide a low hardness (25 Shore 00) solution with 1.5 W/m-K of thermal conductivity

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Parker Chomerics THERM-A-GAP 974 High Thermal Conductivity Gap Filler Pads

Parker Chomerics THERM-A-GAP™ 974 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore A) solution with 6.0 W/m-K of thermal conductivity

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Parker Chomerics THERM-A-GAP 976 High Thermal Conductivity Gap Filler Pads

Parker Chomerics THERM-A-GAP™ 976 Thermally Conductive Gap Filler Pads provide a low hardness (10 Shore A) solution with 6.5 W/m-K of thermal conductivity

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Parker Chomerics THERM-A-GAP G974 High Thermal Conductivity Gap Filler Pads

Parker Chomerics THERM-A-GAP™ G974 Thermally Conductive Gap Filler Pads provide a low hardness (40 Shore A) solution with 5.0 W/m-K of thermal conductivity.

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Parker Chomerics THERM-A-GAP GEL 30 High Performance Fully Cured Dispensable GELS

Parker Chomerics THERM-A-GAP™ Gel 30 is a single-component, fully cured, dispensable gel with 3.5 W/m-K Thermal Conductivity

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Parker Chomerics THERM-A-GAP GEL 30G High Performance Fully Cured Dispensable GELS

Explore THERM-A-GAP GEL 30G, a 3.5 W-m/K, fully cured dispensable thermal interface gel but with added glass beads for bondline thickness control.

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Parker Chomerics THERM-A-GAP GEL 45 High Performance Fully Cured Dispensable GELS

Parker Chomerics THERM-A-GAP™ Gel 45 is a single-component, fully cured, dispensable gel with 4.5 W/m-K Thermal Conductivity

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Parker Chomerics THERM-A-GAP GEL 8010 High Performance Fully Cured Dispensable GELS

Parker Chomerics THERM-A-GAP™ Gel 8010 is a single-component, fully cured, thin bond line, dispensable gel with 3.0 W/m-K Thermal Conductivity

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Parker Chomerics THERM-A-GAP HCS10 Thermally Conductive Gap Filler Pads

Parker Chomerics THERM-A-GAP™ HCS10 Thermally Conductive Gap Filler Pads provide an ultra low hardness (4 Shore 00) solution with 1.0 W/m-K of thermal conductivity

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Parker Chomerics THERM-A-GAP TC50 High Performance Dispensable Thermal Putty

Parker Chomerics THERM-A-GAP™ TC50 is a single-component, fully cured, dispensable putty with 5.0 W/m-K Thermal Conductivity

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Parker Chomerics THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads

Parker Chomerics THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads provide a low hardness (30 Shore 00) solution with 3.0 W/m-K of thermal conductivity

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Parker Chomerics THERMATTACH T404 Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T404 double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks as well as excellent dielectric strength.

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Parker Chomerics THERMATTACH T405 Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T405 double-sided thermal interface tapes provide exceptional bonding between electronic components and heat sinks.

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Parker Chomerics THERMATTACH T405-R Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T405-R double-sided thermal interface tapes provide exceptional bonding between electronic components and heat sinks.

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Parker Chomerics THERMATTACH T411 Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T411 double-sided thermal interface tapes provide exceptional bonding between electronic components and heat sinks, especially on plastic packages and low surface energy materials.

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Parker Chomerics THERMATTACH T412 Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T412 double-sided thermal interface tapes provide superior thermal conductivity and exceptional bonding properties between electronic components and heat sinks.

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Parker Chomerics THERMATTACH T414 Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T414 double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks as well as excellent dielectric strength.

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Parker Chomerics THERMATTACH T418 Double-Sided Thermal Tapes

Parker Chomerics THERMATTACH® T418 double-sided thermal interface tapes provide superior adhesion strength between electronic components and heat sinks as well as the best conformability to components.

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Parker Chomerics THERM-A-GAP 569 Thermally Conductive Gap Filler Pads

Parker Chomerics THERM-A-GAP™ 569 Thermally Conductive Gap Filler Pads provide a very low hardness (10 Shore 00) solution with 1.5 W/m-K thermal conductivity

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Parker Chomerics THERM-A-GAP 580 Thermally Conductive Gap Filler Pads

Parker Chomerics THERM-A-GAP™ 580 Thermally Conductive Gap Filler Pads provide a moderate hardness (75 Shore 00) solution with 3.0 W/m-K of thermal conductivity