Chomerics, part of the Parker Hannifin Corporation Engineered Materials Group, is the world leader in the development and application of electrical conductive and thermal interface materials.
Parker Chomerics SPRINGMESH Highly Resilient Metal Mesh EMI Gasketing
Parker Chomerics SPRINGMESH™ metal mesh gaskets provide excellent EMI shielding and compression set characteristics, making them ideal for enclosure joins and seams
Parker Chomerics CHO-BOND® 1029 conductive adhesive is a two-component, silver-plated copper filled silicone formulated for flexible, strong, and electrically conductive bonds
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required
Parker Chomerics TECKNIT 8116 Conductive adhesive is a two-component, silver-filled epoxy
Parker Chomerics PRO-SHIELD 7058 is a two-component, highly conductive adhesive system that combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver.
Parker Chomerics CHO-SHIELD® 2044 EMI coating is a one-component, nickel-filled acrylic coating that provides modest EMI shielding and a highly durable coating on plastic housings
PART NUMBER: 52-03-2044-0000
Parker Chomerics CHO-SHRINK® 1120 is an electrically conductive, heat-shrinkable material designed to provide good EMI shielding of cables and connectors in commercial applications and at a low cost.
Parker Chomerics CHO-SHIELD® 2040 EMI coating is a one-component, silver-filled conductive acrylic coating that is specially formulated to provide premium EMI shielding on plastic substrates
PART NUMBER: 52-03-2040-0000
Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating