Chomerics, part of the Parker Hannifin Corporation Engineered Materials Group, is the world leader in the development and application of electrical conductive and thermal interface materials.
Parker Chomerics SHIELDMESH Compressed Metal Mesh Gaskets
Parker Chomerics SHIELDMESH™ Compressed Metal Mesh Gaskets are made of die-compressed knitted wire and make an ideal solution for small round or rectangular EMI shielding applications
Parker Chomerics CHO-BOND® 1030 conductive adhesive is a single component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates
Parker Chomerics SOFT-SHIELD® 1000 series gaskets are made of foam wrapped in a fine knitted wire mesh and are intended for low compression force, electronic enclosure sealing applications.
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required
Parker Chomerics PRO-SHIELD 7058 is a two-component, highly conductive adhesive system that combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver.
Parker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages.
CHO-SHIELD 604 HIGHLY ELECTRICALLY CONDUCTIVE SILVER POLYURETHANE EMI COATING FOR SEMICONDUCTOR PACKAGES
Parker Chomerics CHO-SHIELD® 604 is a highly conductive, flexible, advanced coating developed for high volume, precise spray applications on circuit boards and semiconductor packages.
PART NUMBER: 52-01-0604-0000
Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating