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Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM ™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W / mk thermal conductivity.

Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM ™ 1642 is a two-component, general duty, economical thermally conductive encapsulant / sealant / caulk with high shelf life (12 months) and low viscosity

Parker Chomerics THERM-A-FORM CIP35 Thermally Conductive Cure-In-Place Compound

Parker Chomerics THERM-A-FORM ™ CIP35 is two component dispensable thermal compound with 3.5 W / mK thermal conductivity.

Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM ™ T642 is a two-component, silicone elastomer with 1.20 W / mk thermal conductivity and ideal for underfilling applications.

Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM ™ T646 is a two-component, high pot life (5 hours), economical silicone elastomer with 0.9 W / mk thermal conductivity

Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM ™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W / mk) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.

Parker Chomerics THERM-A-FORM ™ T644 Cure-in-Place Potting and Underfill Materials

Parker Chomerics THERM-A-FORM ™ T644 is a two-component, high thermal conductivity (1.2 W / mk), low modulus, silicone material ideal for transferring heat from fragile electronic components.